On November 21, the Chinese Academy of Engineering (CAE) announced its list of newly elected academicians for 2025. Professor Li Erping, Qiushi Chair Professor at Zhejiang University, Director of the Research Center for Electronic and Intelligent Sensing Technology, and Professor at the School of Information and Electronic Engineering, was elected as a foreign academician of the CAE.
11月21日，中国工程院公布2025年新增院士名单。浙江大学求是讲席教授、电子与智能感控技术研究中心主任、信息与电子工程学院李尔平教授当选为中国工程院外籍院士。
The entire Asia Pacific Science and Technology Association (APSTA) extended its warmest congratulations to Honorary Advisor Professor Li Erping on his election as a foreign academician of the CAE.
亚太科学技术协会全体成员对荣誉顾问李尔平教授当选中国工程院外籍院士表示热烈祝贺。
Professor Li Erping is an international pioneer and leader in electromagnetic compatibility (EMC) for micro/nano chips and integrated packaging. He was the first to introduce quantum current density to extend Maxwell’s equations, discovering the quantum tunneling effect of microscopic charge transfer in extremely small-scale circuits, thus driving the development of the nanoscale semiconductor miniaturization technology industry in the post-Moore’s Law era.
李尔平是微纳芯片及封装集成电磁兼容国际开拓者和引领者。率先引入量子电流密度拓展麦克斯韦方程，发现了极小尺度电路中微观电荷转移的量子隧穿效应，推动了后摩尔时代纳尺度半导体超小型化技术产业发展。
He established a cross-scale synergistic theory of EMC, solving the problem of high-frequency electromagnetic interference when Moore’s Law approaches its physical limits, which has become the dominant design standard for electromagnetic design specifications of high-performance chips and packaging.
他建立了电磁兼容跨尺度协同理论，解决摩尔定律逼近物理极限时的高频电磁干扰问题，成为高性能芯片及封装电磁设计规范主导设计标准。
He solved the problems of broadband electromagnetic isolation and high-efficiency suppression, achieving all-round electromagnetic protection. His research in this field is world-leading and widely used in the micro/nano integrated circuit and communication industries.
他解决了宽带电磁隔离及高能效抑制难题，实现全方位电磁防护，相关成果在该领域研究世界领先，并在微纳集成电路和通信产业广泛应用。
He was elected an IEEE Fellow in 2008 and joined Zhejiang University in 2009 after being selected as one of the first batch of specially appointed experts under the “National High-Level Talent Program of China”. He was elected an Academician of the Singapore Academy of Engineering in 2022.
2008年当选 IEEE Fellow，2009年入选首批“中国国家高层次人才计划”特聘专家后加入浙江大学。2022年当选新加坡工程院院士。
He has published 420 journal articles and 6 monographs. His outstanding academic achievements have won more than 20 important academic awards at home and abroad. He is also the only Chinese scholar in the world to have won the three major international awards in this field. The three major international awards are: the highest award, the IEEE Richard Stoddart Award for Outstanding Achievement (awarded to only one person worldwide each year), the Laurence G. Cumming Award for Outstanding Contribution, and the IEEE Technical Achievement Award.
发表期刊论文420篇，专著6部，其杰出学术成果荣获国内外重要学术奖20余项，他还是全球唯一获该领域的国际三大奖的华人学者，国际三大奖为：最高奖IEEE理查德·斯托达特（Richard Stoddart Award）杰出成就奖(全球每年仅授一位)、劳仑斯·克明(Laurance G. Cumming Award)卓越贡献奖和IEEE技术成就奖。
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